Method for producing flexible circuit boards

ABSTRACT

An adhesive is applied onto a flexible resistive film 1 and dried to form an adhesive layer 2. A metal foil 3 is contacted onto the layer 2, which is subjected to a heat and pressing treatment. The foil 3 is polished. An ultraviolet light curable ink is applied on the foil 3 and dried to form a first layer 4. A negative film is placed on or over the layer 4 and ultraviolet light is irradiated thereto through the film so that the layer 4 is cured. Uncured portions of the layer 4 is removed so that cured portions thereof remain and the foil 3 is exposed between the remaining cured portions. The metal foil 3 is subjected to an etching treatment to remove exposed portions of the foil 3 so that unexposed portions of the foil 3 remain and form conductors 3A. The cured portions of the layer 4 is removed from the conductors 3A. A metal plating film 5 is formed on each conductor 3A to form each electrical conductive circuit 9. An ultraviolet light curable ink is applied on the layer 2 and dried to form a second layer 7. Ultraviolet light is irradiated to the layer 7 through the film 1 so that the layer 7 is cured in gaps 6 between the circuits 9. Uncured portions of the layer 7 is removed so that the circuits 9 are exposed and cured portions of the layer 7 remain in the gaps 6. The cured portions of the layer 7 is subjected to a heat treatment. The resulting flexible circuit board comprises the film 1, the adhesive layer 2, the circuits 9 and cured films 8 filling the gaps 6.

This is a divisional of Ser. No. 08/264,781, filed on Jun. 23, 1994, nowU.S. Pat. No. 5,493,074.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to flexible circuit boards and a methodfor producing the same. Such boards are widely used as connectingdevices in electronic devices such as liquid crystal display tubes, ECDand solar cells for mechanically and electrically connecting electrodeportions of the electronic devices and of a print circuit board.

2. Description of the Related Art

Recently, flexible circuit boards have been used in electronic devicessuch as liquid crystal display tubes, ECD and solar cells formechanically and electrically connecting electrode portions of theelectronic devices and a print circuit board. So called anisotropicconductive membrane devices have been widely used for connecting theflexible circuit boards. The anisotropic conductive membrane device ismade of a hot melt adhesive containing conductive fine particles. FIG. 1is a cross sectional view schematically showing an example of suchflexible circuit board 20. An adhesive layer 2 is formed on a flexibleresistive film 1 and electrical conductive layers 9 are formed on theadhesive layer 2. Each electrical conductive layer 9 is consisting of aconductor 3A of the metal foil having a predetermined pattern and ametal plating layer 5 covering the surface of the conductor 3A. Whenproducing such flexible circuit board 20, a metal foil is adhered to theflexible resistive film 1 with an appropriate adhesive and thenprocessed according to a photoresist technique to provide each conductor3A with a predetermined pattern as shown in FIG. 1, which is thencovered with the metal plating layer 5 to provide each electricalconductive layer 9.

Therefore, as shown in FIG. 1, which is a cross sectional view of theflexible circuit board 20, the electrical conductive circuits 9 areformed as protruding portions and gaps 6 are left between the electricalconductive circuits 9. However, when the electrode portions of the printcircuit board and/or the electronic devices and terminal portions of theflexible circuit board 20 are mechanically and electrically connected bymeans of the hot melt adhesive, adhesive strengths between the electrodeportions and the terminal portions are occasionally lowered, because thegaps 6 are formed in the surface of the flexible circuit board 20.Moreover, the conductive fine particles in the anisotropic conductivemembrane device occasionally flow into the gaps 6 and electricalresistances between the electrode portions and the terminal portions areincreased.

SUMMARY OF THE INVENTION

It is an object of the invention to provide a flexible circuit boardwherein adhesive strengths between electrode portions of a print circuitboard and/or an electronic device and terminal portions of the flexiblecircuit board may be improved.

It is another object of the invention to prevent that electricalresistances between the electrode portions and the terminal portions areincreased.

The present invention provides a flexible circuit board comprising: aflexible resistive film; an adhesive layer formed on said flexibleresistive film; electrical conductive circuits being formed on saidadhesive layer, each electrical conductive circuit comprising aconductor of a metal foil and a metal plating film covering the surfaceof said conductor; and cured films filling gaps formed between saidelectrical conductive circuits, said cured films being composed of acured product of an ultraviolet light curable ink.

The present invention also provides a process for producing a flexiblecircuit board comprising the steps of:

(A) applying an adhesive onto a flexible resistive film and drying theadhesive to form an adhesive layer;

(B) contacting a metal foil onto said adhesive layer, which is subjectedto a heat and pressing treatment so that said flexible resistive filmand said metal foil are adhered to each other;

(C) polishing a surface of said metal foil to obtain a polished surface,onto which an ultraviolet light curable ink is applied and dried to forma first layer composed of said ink;

(D) placing a negative film with a predetermined pattern on or over saidfirst layer and irradiating ultraviolet light to said first layerthrough said negative film so that said first layer is cured accordingto said predetermined pattern of said negative film;

(E) removing uncured portions of said first layer in the stage (D) sothat cured portions of said first layer remain according to saidpredetermined pattern and said metal foil is exposed between saidremaining cured portions;

(F) subjecting said metal foil to an etching treatment to remove exposedportions of said metal foil between said cured portions so thatunexposed portions of said metal foil remain to form conductors;

(G) removing said cured portions of said first layer from saidconductor;

(H) forming a metal plating film on each conductor to form eachelectrical conductive circuit comprising said conductor and said metalplating film covering the surface of said conductor;

(I) applying an ultraviolet light curable ink on said adhesive layer anddrying said ink to form a second layer;

(J) irradiating ultraviolet light to said second layer through saidflexible resistive film so that said second layer is cured by theultraviolet light in gaps between said electrical conductive circuits;

(K) removing uncured portions of said second layer so that saidelectrical conductive circuits are exposed and cured portions of saidsecond layer remain in said gaps;

(L) subjecting said cured portions of said second layer to a heattreatment.

According to the flexible circuit board of the present invention, eachgap formed between the electrical conductive circuits is filled with acured film composed of a cured product of an ultraviolet light curableink. Therefore, in a cross sectional view of the flexible circuit boardas shown in FIG. 2, the gaps between the circuits are filled with thecured films and the circuits are not protruded from the cured films. Inother words, a flat surface is formed by filling the gaps with the curedfilms.

Therefore, when electrode portions of a print circuit board and/or anelectronic device and terminal portions of the flexible circuit boardare mechanically and electrically connected by means of a hot meltadhesive, it is possible to avoid the lowering of adhesive strengthsbetween the electrode portions and the terminal portions and to maintainthem over a predetermined value in a practical manufacturing process,because the gaps are filled with the cured films to form the flatsurface. Moreover, it is possible to prevent that conductive fineparticles in an anisotropic conductive membrane device flow into thegaps to increase an electrical resistance between the electrode portionsand the terminal portions.

According to the process for producing a flexible circuit board of thepresent invention, after forming the electrical conductive circuits, theultraviolet light curable ink is applied on the adhesive layer and driedto form the second layer, to which ultraviolet light is irradiatedthrough the flexible resistive film so that the second layer is cured bythe ultraviolet light in gaps between the circuits, and then the uncuredportion of the second layer is removed so that the circuits are exposed.After these stages, the gaps formed between the circuits are filled withthe cured film composed of the cured product of the ink.

As a result, it is possible to fill the gaps inevitably formed betweenthe circuits with the cured films so that the circuits are not protrudedfrom the cured films and a flat surface is formed. Moreover, thesestages may be easily carried out by applying and modifying priorphotoresist techniques and facilities without introducing newfacilities. Therefore, the present invention is extremely useful in theart and may be widely used in various electronic devices such as liquidcrystal display tubes, ECD's, solar cells or the like, which are used invarious electrical and electronic instruments such as word processors,watches, cameras and various display devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view schematically showing a prior flexiblecircuit board 20, wherein an adhesive layer 2 is formed on a flexibleresistive film 1 and electrical conductive circuits 9 are formed on theadhesive layer 2;

FIG. 2(a) is a cross sectional view schematically showing a first layer4 composed of an ultraviolet light curable ink formed on a metal foil 3;

FIG. 2(b) is a cross sectional view schematically showing electricalconductive circuits 9 comprising conductors 3A and metal plating films 5covering the surfaces of the conductors 3A;

FIG. 2(c) is a cross sectional view schematically showing a second layer7 composed of an ultraviolet light curable ink formed on the adhesivelayer 2;

FIG. 3(a) is a plain view schematically showing a flexible circuit board10 according to the present invention;

FIG. 3(b) is a cross sectional view schematically showing the flexiblecircuit board 10.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A flexible circuit board 10 according to the preferred embodiment of theinvention and its manufacturing process will now be explained belowreferring to FIGS. 2 and 3. First, in the stage (A), an adhesive isapplied onto a flexible resistive film 1 and dried to form an adhesivelayer 2 as shown in FIG. 2(a). The flexible resistive film 1 maypreferably made of a resin selected from a group consisting of apolyester resin, a polyimide resin, a polyetherimide resin, apolycarbonate resin and an aramide (aromatic amide) resin.

The adhesive may preferably be an epoxy adhesive. A thickness of anapplied layer of the adhesive before drying may preferably be 5.0 to30.0 μm. When the thickness is below 5.0 μm, an adhesive strength of theadhesive layer is not enough. When the thickness is more than 30.0 μm,flexibility of the resulting flexible circuit board may be lost todegrade reliability of connection between the electrode portions and theterminal portions of the flexible circuit board. The adhesive layer maybe dried using a far infrared ray furnace.

In the stage (B), a metal foil 3 is contacted onto the adhesive layer 2,which is subjected to a heat and pressing treatment so that the flexibleresistive film 1 and the metal foil 3 are adhered to each other. Athickness of the metal foil 3 may preferably be 4 to 70 μm. The heat andpressing treatment may be carried out in a temperature of 100° C. to150° C. and in a pressure of 1 to 5 kg/cm. After the flexible resistivefilm 1 and the metal foil 3 are adhered to each other, the adhesivelayer 2 may preferably be aftercured in a temperature of 80° C. to 180°C. for 1 to 24 hours in a hot-blast stove.

Then, in the stage (C), a surface of the metal foil 3 is polished toobtain a polished surface, onto which an ultraviolet light curable inkis applied and dried to form a first layer 4 composed of an ultravioletlight curable ink as shown in FIG. 2(a). The ink may preferably be aphotoetching resist ink comprising a photosensitive acrylic polymer(such as polyacrylic ester) or a photosensitive epoxy polymer as itsmain component. An apparent specific gravity of the ultraviolet lightcurable ink may preferably be 0.9 to 2.0 and a viscosity thereof maypreferably be 0.1 to 1000 poise.

A thickness of the applied layer of the ink before drying may preferablybe 5 to 20 μm. When the thickness is below 5 μm, resistance of theapplied layer against bending is degraded. When the thickness is over 20μm, it is rather difficult to expose ultraviolet light over the wholethickness of the applied layer so that a resolving power of the ink isdegraded in the following developing process. The applied layer of theink may preferably be dried in a temperature of 40° to 100° C. for 3minutes to 6 hours.

In the stage (D), a negative film with a predetermined pattern is placedon or over the first layer 4 and ultraviolet light is irradiated to thefirst layer 4 through the negative film so that the first layer 4 iscured in regions ultraviolet light pass through the negative film. Suchregions are decided according to the predetermined pattern of thenegative film.

In the stage (E), uncured portions of the first layer 4 in the stage (D)are removed by using a developing solution so that cured portions of thefirst layer 4 remain according to the predetermined pattern and themetal foil 3 are exposed between the remaining cured portions. A patternof the remaining cured portions of the first layer 4 provides a patternof electrical conductive circuits in the following stages. Then, theremaining cured portions may preferably be dried in a temperature of 30°to 100° C.

In the stage (F), the metal foil 3 is subjected to an etching treatmentto remove the exposed portions of the metal foil 3 between the curedportions so that unexposed portions 3A (as shown in FIG. 2(b)) of themetal foil remain as conductors under the cured portions. Then, anetching solution may preferably be washed by water and the flexibleresistive film 1 may preferably be dried in a temperature of 40° to 100°C.

In the stage (G), the cured portions of the first layer 4 are removedfrom the conductors 3A to expose surfaces thereof. The cured portionsmay preferably be washed by using a weak alkaline solution. The surfacesof the metal foils 3A may preferably be subjected to a pre-etching or asurface activating treatment by using an acidic solution.

In the stage (H), as shown in FIG. 2(b), a metal plating film 5 isformed on each remaining conductor 3A to form each electrical conductivecircuit 9, which comprises the conductor 3A and the metal plating film 5covering the surface of the conductor 3A. The metal plating film 5 maypreferably be a solder film or a tin film formed by an electrolyticplating process, a solder film or a tin film formed by an electrolessplating process, or a laminated film comprising a gold plating filmformed on a nickel plating film. A thickness of the metal plating film 5may preferably be 0.5 to 15 μm. Then, a plating solution may preferablybe washed by a surface activating treatment and water and the flexibleresistive film 1 may preferably be dried in a temperature of 40° to 100°C. Gaps 6 are formed between the electrical conductive circuits 9.

In the stage (I), an ultraviolet light curable ink is applied on theadhesive layer 2 to form an applied layer, which is dried to form asecond layer 7 composed of the ink as shown in FIG. 2(c). The secondlayer 7 filled in the gaps 6 and also formed on the circuit 9. Theultraviolet light curable ink may preferably be a negative-typephotoetching resist ink comprising a photosensitive acrylic polymer(such as polyacrylic ester) or a photosensitive epoxy polymer as itsmain component. An apparent specific gravity of the ultraviolet lightcurable ink may preferably be 0.9 to 2.0 and a viscosity thereof maypreferably be 0.1 to 1000 poise. A thickness of the applied layer of theink before drying may preferably be 10 to 80 μm. The applied layer maypreferably be dried in a temperature of 20° to 80° C. for 10 minutes to12 hours.

In the stage (J), ultraviolet light is irradiated to the second layer 7through the flexible resistive film 1 as arrows A shown in FIG. 2(c), sothat the second layer 7 is cured by the ultraviolet light in gaps 6between the electrical conductive circuits 9. Simultaneously, becausethe ultraviolet light is irradiated through the film 1, the light doesnot pass through the electrical conductive circuits 9, so that the inkis not cured on the circuits 9.

In the stage (K), uncured portions of the second layer 7 are removed byusing a developing solution so that the electrical conductive circuits 9are exposed and the cured portions of the second layer 7 remains in thegaps 6. Then, in the stage (L), the cured portions of the second layer 7is subjected to a heat treatment. The heat treatment may preferably becarried out in a temperature of 100° to 150° C. for 10 minutes to 3hours in a hot-blast stove to aftercure the cured portions of the secondlayer 7. When the temperature is lower than 100° C., the cured portionsare not thoroughly aftercured and its heat resistance may beoccasionally insufficient. When the temperature is higher than 150° C.,thermal shrinkage of the flexible resistive film 1 may occur during theheat treatment to degrade flexibility thereof.

After the heat treatment, as shown in FIGS. 3(b), the cured portions areaftercured to form cured films 8, which is composed of a cured productof the ultraviolet light curable ink. Consequently, as schematicallyshown in FIGS. 3(a) and 3(b), the gaps 6 between the electricalconductive circuits 9 of the flexible circuit board 10 is filled withthe cured films 8. The resulting board 10 may be cut into articles witha desired length and width.

When using the flexible circuit board of the present invention, ananisotropic conductive membrane device or the like is inserted betweenterminal portions in one end portion on one side of the flexible circuitboard and electrode portions of one of various electronic devices. Ananisotropic conductive membrane device or the like is also insertedbetween terminal portions in the other end portion on said one side ofthe flexible circuit board and electrode portions of a print circuitboard. Both end portions on said one side of the flexible circuit boardis then subjected to a heat and a pressing treatment to mechanically andelectrically connect the terminal portions and electrode portions.

The heat treatment may preferably be carried out in a temperature of100° to 200° C. and the pressing treatment may preferably be carried outat a pressure of 10 to 70 kg/cm². When the temperature is lower than100° C., the terminal portions and the electrode portions are notadhered to each other. When the temperature is higher than 200° C., theanisotropic conductive membrane device may decomposes and thermalshrinkage of the flexible resistive film 1 may occur during the heattreatment. When the pressure is lower than 10 kg/cm², the terminalportions and the electrode portions are not adhered to each other. Whenthe pressure is higher than 70 kg/cm², the electrical conductivecircuits may occasionally break out.

The present invention for producing the flexible circuit boards isdescribed in more detail in the following examples 1 to 3.

EXAMPLE 1

An epoxy adhesive was applied onto a surface of a polyester film (aflexible resistive film) 1 with a thickness of 50 μm to form an appliedlayer, which was then dried in a far infrared ray furnace to form anadhesive layer 2 with a thickness of 20 μm (the stage (A)). Anelectrolytic copper foil 3 with a thickness of 18 μm was contacted ontothe adhesive layer 2, which was subjected to a heat and pressingtreatment in a temperature of 110° C. and in a pressure of 3 kg/cm sothat the polyester film 1 and the copper foil 3 were adhered to eachother. After this, the adhesive layer 2 was aftercured (thermal curing)in a temperature of 150° C. for 3 hours in a hot-blast stove (the stage(B)).

A surface of the copper foil 3 was polished by using a buff to obtain apolished surface, onto which an ultraviolet light curable ink wasapplied and dried in a temperature of 100° C. for 5 minutes to form afirst layer 4 composed of the ink. The ink was a photoetching resist inkproduced by mixing 25 weight % of a photosensitive epoxy polymer, 10weight % of an acrylic ester photopolymerization initiator, 35 weight %of ethylcellosolve acetate, 15 weight % of toluene and 15 weight % ofxylene and dispersing these ingredients uniformly. An apparent specificgravity of the ultraviolet light curable ink was 0.95 and a viscositythereof was 80 poise. A thickness of the applied layer of the ink beforedrying was 10 μm (the stage (C)).

A negative film with a predetermined pattern was placed onto the firstlayer 4 and adhered thereto by using vacuum. Ultraviolet light (80mJ/cm²) was irradiated to the first layer 4 through the negative film sothat the first layer 4 was cured according to the predetermined patternof the negative film (the stage (D)).

Uncured portions of the first layer 4 were removed by using a developingsolution and washed well with water. After removing the developingsolution, water remained on the exposed copper foil 3 was blow out byblowing air, and the remaining cured portions were then dried in atemperature of 85° C. for 30 minutes in a warm-blast stove (the stage(E)). The copper foil 3, which was exposed between the cured portions ofthe first layer 4, is subjected to an etching treatment to remove theexposed portions of the foil 3. An etching solution was then washed bywater and the polyester film 1 was dried by blowing warm air of 120° C.for 5 minutes (the stage (F)).

The cured portions of the first layer 4 were removed from conductors 3Aby using 5% sodium hydroxide solution. The exposed surfaces of theconductors 3A were activated by using 3% hydrochloric acid solution (thestage (G)). A solder film 5 with a thickness of 2 to 3 μm was thendeposited on the surface of each conductor 3A by an electrolytic 9:1solder plating process. The surfaces of the solder films 5 were thensubjected to a surface activating treatment with sodium tertiallyphosphate and a plating solution was washed well by water. The flexibleresistive film 1 was dried by blowing warm air of 70° C. (the stage(H)).

An ultraviolet light curable ink was then applied on the adhesive layer2 to form an applied layer, which was dried by blowing warm air of 80°C. for 30 minutes to form a second layer 7 composed of the ink. The inkwas a photoetching resist ink produced by mixing 25 weight % of aphotosensitive epoxy polymer, 10 weight % of an acrylic esterphotopolymerization initiator, 35 weight % of ethylcellosolve acetate,15 weight % of toluene and 15 weight % of xylene and dispersing theseingredients uniformly. An apparent specific gravity of the ink was 0.95and a viscosity thereof was 100 poise. A thickness of the applied layerof the ink before drying was 20 μm (the stage (I)).

Ultraviolet light (150 mJ/cm²) was irradiated to the second layer 7through the flexible resistive film 1 so that the second layer 7 wascured by the ultraviolet light in gaps 6 between the electricalconductive circuits 9 (the stage (J)). Uncured portions of the secondlayer 7 were removed by using a developing solution so that theelectrical conductive circuits 9 were exposed (the stage (K)).

The cured portions of the second layer 7 was then subjecting to a heattreatment in a temperature of 150° C. for 1 hour in a hot-blast stove.The resulting board 10 was cut into articles with desired lengths andwidths.

An anisotropic conductive membrane device was inserted between terminalportions in one end portion on one side of the flexible circuit board 10and electrode portions (having a pitch of 0.20 mm) of a liquid crystaldisplay tube. Another anisotropic conductive membrane device was alsoinserted between terminal portions in the other end portion on said oneside of the board and electrode portions of a print circuit board. Bothend portions on said one side of the flexible circuit board is thensubjected to a heat and a pressing treatment in a temperature of 180° C.and a pressure of 40 kg/cm² to mechanically and electrically connect theterminal portions and the electrode portions.

EXAMPLE 2

An epoxy adhesive was applied onto a surface of a polyetherimide film (aflexible resistive film) 1 with a thickness of 25 μm to form an appliedlayer, which was then dried in a far infrared ray furnace to form anadhesive layer 2 with a thickness of 15 μm (the stage (A)). A copperfoil 3 produced by rolling with a thickness of 35 μm was contacted ontothe adhesive layer 2, which was subjected to a heat and pressingtreatment in a temperature of 120° C. and in a pressure of 3.5 kg/cm sothat the polyetherimide film 1 and the copper foil 3 were adhered toeach other. After this, the adhesive layer 2 was aftercured (thermalcuring) in a temperature of 180° C. for 3 hours in a hot-blast stove(the stage (B)).

A surface of the copper foil 3 was polished by using a buff to obtain apolished surface, onto which an ultraviolet light curable ink wasapplied and dried in a temperature of 85° C. for 20 minutes to form afirst layer 4 composed of the ink. The ink was a photoetching resist inkproduced by mixing 20 weight % of a photosensitive epoxy polymer, 15weight % of an acrylic ester photopolymerization initiator, 40 weight %of ethylcellosolve acetate, 15 weight % of toluene and 15 weight % ofxylene and dispersing these ingredients uniformly. An apparent specificgravity of the ink was 0.8 and a viscosity thereof was 50 poise. Athickness of the applied layer before drying was 8 μm (the stage (C)).

A negative film with a predetermined pattern was placed onto the firstlayer 4 and adhered thereto by using vacuum. Ultraviolet light (50mJ/cm²) was irradiated to the first layer 4 through the negative film sothat the first layer 4 was cured according to the predetermined pattern(the stage (D)).

Uncured portions of the first layer 4 were removed by using a developingsolution and washed well with water. After removing the solution, waterremained on the exposed copper foil 3 was blow out by blowing air andthe remaining cured portions were then dried in a temperature of 100° C.for 10 minutes in a warm-blast stove (the stage (E)). The copper foil 3,which was exposed between the cured portions, is subjected to an etchingtreatment to remove the exposed portions of the foil 3. An etchingsolution was then washed by water and the polyetherimide film 1 wasdried by blowing warm air of 80° C. for 10 minutes (the stage (F)).

The cured portions were removed from the conductors 3A by using 5%sodium hydroxide solution. The exposed surface of the conductors 3A wasactivated by using 3% hydrochloric acid solution (the stage (G)). A tinfilm 5 with a thickness of 0.5 to 1.0 μm was then deposited on thesurface of each conductor 3A by an electroless tin plating process. Thesurface of the tin film 5 was then subjected to a surface activatingtreatment with sodium tertially phosphate and a plating solution waswashed by water. The flexible resistive film 1 was dried by blowing warmair of 60° C. (the stage (H)).

An ultraviolet light curable ink was then applied on the adhesive layer2 to form an applied layer, which was dried in a temperature of 100° C.for 1 hour. The ink was a negative-type photoetching resist inkcomprising a photosensitive epoxy polymer as a main component. Anapparent specific gravity of the ink was 0.95 and a viscosity thereofwas 120 poise. A thickness of the applied layer before drying was 40 μm(the stage (I)).

Ultraviolet light (200 mJ/cm²) was irradiated to the second layer 7through the flexible resistive film 1 so that the second layer 7 wascured by the ultraviolet light in gaps 6 between the electricalconductive circuits 9 (the stage (J)). Uncured portions of the secondlayer 7 were removed by using a developing solution so that theelectrical conductive circuits 9 were exposed (the stage (K)). The curedportions of the second layer 7 was then subjected to a heat treatment ina temperature of 160° C. for 3 hours in a hot-blast stove (the stage(L)). The resulting board 10 was cut into articles with desired lengthsand widths.

An anisotropic conductive membrane device was inserted between terminalportions in one end portion on one side of the flexible circuit board 10and electrode portions (having a pitch of 0.20 mm) of a liquid crystaldisplay tube. Another anisotropic conductive membrane device was alsoinserted between terminal portions in the other end portion on said oneside of the board and electrode portions of a print circuit board. Bothend portions on said one side of the flexible circuit board is thensubjected to a heat and a pressing treatment in a temperature of 190° C.and a pressure of 35 kg/cm² to mechanically and electrically connect theterminal portions and the electrode portions.

EXAMPLE 3

An epoxy adhesive was applied onto a surface of a polyimide film 1 witha thickness of 25 μm to form an applied layer, which was then dried in afar infrared ray furnace to form an adhesive layer 2 with a thickness of10 μm (the stage (A)). An electrolytic copper foil 3 with a thickness of8 μm was contacted onto the adhesive layer 2, which was subjected to aheat and pressing treatment in a temperature of 95° C. and in a pressureof 2.5 kg/cm so that the polyimide film 1 and the copper foil 3 wereadhered to each other. After this, the adhesive layer 2 was aftercuredin a temperature of 160° C. for 1 hour and in a temperature of 190° C.for 1 hour in a hot-blast stove (the stage (B)).

A surface of the copper foil 3 was polished by using a buff to obtain apolished surface, onto which an ultraviolet light curable ink wasapplied and dried in a temperature of 70° C. for 1 hour to form a firstlayer 4 composed of the ink. The ink was a photoetching resist inkproduced by mixing 25 weight % of a photosensitive acrylic polymer, 10weight % of an acrylic ester photopolymerization initiator, 40 weight %of ethylcellosolve acetate, 2 weight % of toluene, 3 weight % of xyleneand 2 weight % of methylethylketone and dispersing these ingredientsuniformly. An apparent specific gravity of the ink was 0.9 and aviscosity thereof was 30 poise. A thickness of the applied layer beforedrying was 15 μm (the stage (C)).

A negative film was placed onto the first layer 4 and adhered thereto byusing vacuum. Ultraviolet light (100 mJ/cm²) was irradiated to the firstlayer 4 through the negative film so that the first layer 4 was curedaccording to the predetermined pattern of the negative film (the stage(D)).

Uncured portions of the first layer 4 were removed by using a developingsolution and washed well with water. After removing the solution, waterremained on the exposed copper foil 3 was blown by air and the remainingcured portions were then dried in a temperature of 60° C. for 1 hour(the stage (E)). The exposed copper foil 3 was subjected to an etchingtreatment. An etching solution was then washed by water and thepolyimide film 1 was dried by blowing warm air of 65° C. for 30 minutes(the stage (F)).

The cured portions were removed from the conductors 3A by using 5%sodium hydroxide solution. The exposed surfaces of the conductors 3Awere activated by using 3% hydrochloric acid solution (the stage (G)). Anickel plating film with a thickness of 1 μm was deposited on thesurface of each conductor 3A by an electrolytic plating process and agold plating film with a thickness of 0.3 to 0.5 μm was deposited on thenickel plating film to form a metal plating film 5. A plating solutionwas washed by cold water and hot water. The polyimide film 1 was driedby blowing warm air of 80° C. (the stage (H)).

An ultraviolet light curable ink was then applied on the adhesive layer2 to form an applied layer, which was dried by blowing warm air of 65°C. for 10 minutes to form a second layer 7. The ink was a negative-typephotoetching resist ink comprising a photosensitive epoxy polymer as amain component. An apparent specific gravity of the ink was 0.95 and aviscosity thereof was 100 poise. A thickness of the applied layer beforedrying was 10 μm (the stage (I)).

Ultraviolet light (120 mJ/cm²) was irradiated to the second layer 7through the polyimide film 1 so that the second layer 7 was cured ingaps 6 between the electrical conductive circuits 9 (the stage (I)).Uncured portions of the second layer 7 were removed by using adeveloping solution so that the circuits 9 were exposed (the stage (K)).The cured portions of the second layer 7 was then subjecting to a heattreatment in a temperature of 130° C. for 30 minutes in a hot-blaststove (the stage (L)). The resulting board 10 was cut into articles withdesired lengths and widths.

An anisotropic conductive membrane device was inserted between terminalportions in one end portion on one side of the flexible circuit board 10and electrode portions (having a pitch of 0.20 mm) of a liquid crystaldisplay tube. Another anisotropic conductive membrane device was alsoinserted between terminal portions in the other end portion on said oneside of the board and electrode portions of a print circuit board. Bothend portions on said one side of the flexible circuit board is thensubjected to a heat and a pressing treatment in a temperature of 190° C.and a pressure of 35 kg/cm² to mechanically and electrically connect theterminal portions and the electrode portions.

As described above, according to the flexible circuit board of thepresent invention, the gaps between the electrical conductive circuitsare filled with the cured films and a flat surface is formed. Therefore,when electrode portions of one of various devices are mechanically andelectrically connected with terminal portions of the flexible circuitboard, and when electrode portions of a print circuit board aremechanically and electrically connected with the terminal portions, itis possible to avoid the lowering of adhesive strengths between theelectrode portions and the terminal portions and to maintain them over apredetermined value in a practical manufacturing process, Moreover, itis possible to prevent that conductive fine particles in an anisotropicconductive membrane device flow into the gaps to increase an electricalresistance between the electrode portions and the terminal portions.

According to the process for producing a flexible circuit board of thepresent invention, it is possible to fill the gaps inevitably formedbetween the electrical conductive circuits with cured films so that thecircuits are not protruded from the cured films and a flat surface isformed. Moreover, these stages may be easily carried out by applying andmodifying prior photoresist techniques and facilities withoutintroducing new facilities. Therefore, the present invention isextremely useful in the art and may be widely used in various electronicdevices such as liquid crystal display tubes, ECD's, solar cells or thelike, which are used in various electrical and electronic instrumentssuch as word processors, watches, cameras and various display devices.

The present invention has been explained referring to the preferredembodiments, however, the present invention is not limited to theillustrated embodiments which are given by way of examples only, and maybe carried out in various modes without departing from the scope of theinvention.

We claim:
 1. A process for producing a flexible circuit board comprisingthe steps of:(A) applying an adhesive onto a flexible resistive film anddrying the adhesive to form an adhesive layer; (B) contacting a metalfoil onto said adhesive layer, which is subjected to a heat and pressingtreatment so that said flexible resistive film and said metal foil areadhered to each other; (C) polishing a surface of said metal foil toobtain a polished surface, onto which an ultraviolet light curable inkis applied and dried to form a first layer composed of said ultravioletlight curable ink; (D) placing a negative film with a predeterminedpattern on or over said first layer and irradiating ultraviolet light tosaid first layer through said negative film so that said first layer iscured according to said predetermined pattern; (E) removing uncuredportions of said first layer in the stage (D) so that cured portions ofsaid first layer remains according to said predetermined pattern andsaid metal foil is exposed between said remaining cured portions; (F)subjecting said metal foil to an etching treatment to remove the exposedportions of said metal foil between said cured portions so thatunexposed portions of said metal foil under said cured portions remainto form conductors; (G) removing said cured portions of said first layerfrom said conductors of metal foil; (H) forming a metal plating film oneach conductor to form each electrical conductive circuit comprisingsaid conductor and said metal plating film covering a surface of saidconductor; (I) applying an ultraviolet light curable ink on saidadhesive layer and drying said ink to form a second layer composed ofsaid ink; (J) irradiating ultraviolet light to said second layer throughsaid flexible resistive film so that said second layer is cured by theultraviolet light in gaps between said electrical conductive circuits;(K) removing uncured portions of said second layer so that saidelectrical conductive circuits are exposed and cured portions of saidsecond layer remains in said gaps; (L) subjecting said cured portions ofsaid second layer to a heat treatment.
 2. The process for producing aflexible circuit board as claimed in claim 1, wherein, in the stage (I),said ultraviolet light curable ink is a negative type photoetchingresist ink comprising one or more photosensitive polymer selected from agroup consisting of a photosensitive acrylic polymer and aphotosensitive epoxy polymer, as its main component, an apparentspecific gravity of said ultraviolet light curable ink is 0.9 to 2.0, aviscosity thereof is 0.1 to 1000 poise, a thickness of an applied layerof said ultraviolet light curable ink is 10 to 80 μm and saidultraviolet light curable ink is dried in a temperature of 20° to 80° C.for 10 minutes to 12 hours.
 3. The process for producing a flexiblecircuit board as claimed in claim 2, wherein, in the stage (L), saidcured portions of said second layer are subjected to a heat treatment ina temperature of 100° to 150° C. for 10 minutes to 3 hours.
 4. Theprocess for producing a flexible circuit board as claimed in claim 1,wherein, in the stage (A), said flexible resistive film is made of oneor more resin selected from a group consisting of a polyester resin, apolyimide resin, a polyetherimide resin, a polycarbonate resin and anaramide resin.
 5. The process for producing a flexible circuit board asclaimed in claim 4, wherein said adhesive layer is formed of an epoxyadhesive and a thickness of an applied layer of said adhesive beforedrying is 5.0 to 30.0 μm in the stage (A), and a thickness of said metalfoil is 4 to 70 μm, said heat and pressing treatment is carried out in atemperature of 100° C. to 150° C. and in a pressure of 1 to 5 kg/cm andsaid adhesive layer is aftercured in a temperature of 80° to 180° C. for1 to 24 hours.
 6. The process for producing a flexible circuit board asclaimed in claim 4, wherein, in the stage (C), said ultraviolet lightcurable ink is a photoetching resist ink comprising a photosensitiveacrylic polymer or a photosensitive epoxy polymer as its main component,an apparent specific gravity of said ultraviolet light curable ink is0.9 to 2.0, a viscosity thereof is 0.1 to 1000 poise, and a thickness ofan applied layer of the ink before drying is 5 to 20 μm.
 7. The processfor producing a flexible circuit board as claimed in claim 4, whereinsaid cured portions of said first layer are removed from said conductorsof said metal foil by washing said cured portions with a weak alkalinesolution and exposed surfaces of said conductors are subjected to asurface activating treatment by using an acidic solution in the stage(G), and said metal plating film comprises one or more metal platingfilm selected from a group consisting of a solder plating film, a tinplating film, a nickel plating film and a gold plating film, a thicknessof said metal plating film is 0.5 to 15 μm and said flexible resistivefilm is dried in a temperature of 40° to 100° C. after forming saidmetal plating film in the stage (H).